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KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32 KF556S40IBK2-32

Kingston Technology FURY Impact memory module

P/N:KF556S40IBK2-32 | EAN:740617331660 | CHECKSUM: C

32 GB

Product Sheet

Small form factor, mighty DDR5 performance

Warranty: Lifetime

Excl VAT. € 539.72 € 608.51 LIMITED OFFER: SAVE 83.24 € !!!

In stock: 1 ETA: 0000-00-00

Weight: 42.69 g

Description:


Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.

Mighty DDR5 SODIMM performance
With a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.

Plug N Play automatic overclocking functionality
Kingston FURY Impact DDR5’s PnP modules automatically overclock to the highest listed speed.

Intel® XMP 3.0 Certified
Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.

Low Power Consumption, Increased efficiency
Keep your system cool and efficient with Kingston FURY Impact DDR5’s low power draw.

Improved stability with on-die ECC
Maintain data integrity while hitting overclocking speeds.

Specifications:


Features
Buffered memory type: Unregistered (unbuffered)
CAS latency: 40
Component for: Laptop
Country of origin: China, Taiwan
ECCECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.:
Intel Extreme Memory Profile (XMP):
Intel Extreme Memory Profile (XMP) version: 3.0
Internal memory: 32 GB
Internal memory type: DDR5
JEDEC standard:
Lead plating: Gold
Memory clock speed: 5600 MHz
Memory form factor: 262-pin SO-DIMM
Memory layout (modules x size): 2 x 16 GB
Memory ranking: 1
Memory voltage: 1.1 V
Module configuration: 2048M x 64
On-Die ECC:
Programming power voltage (VPP): 1.8 V
Refresh row cycle time: 295 ns
Row active time: 28.56 ns
Row cycle time: 48 ns
Logistics data
Master (outer) case gross weight: 1.28 kg
Master (outer) case height: 101.6 mm
Master (outer) case length: 311.2 mm
Master (outer) case width: 203.2 mm
Products per master (outer) case: 25 pc(s)
Operational conditions
Operating temperature (T-T): 0 - 85 °C
Storage temperature (T-T): -55 - 100 °C
Packaging data
Package depth: 14 mm
Package height: 171.5 mm
Package weight: 42.69 g
Package width: 95.3 mm
Weight & dimensions
DepthThe distance from the front to the back of something.: 69.6 mm
HeightThe measurement of the product from head to foot or from base to top.: 30 mm
WeightWeight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.: 17.77 g
WidthThe measurement or extent of something from side to side.: 3.8 mm

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